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SMP11A-E3 데이터시트

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FEATURES
• Very low profile - typical height of 1.0 mm
• Ideal for automated placement
• Available in uni-directional
• 400 W peak pulse power capability with a 10/1000 µs waveform
• Excellent clamping capability
• Very fast response time
• Low incremental surge resistance
• Meets MSL level 1, per J-STD-020
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

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