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>>> WEDC >>> WED3C7410E16M400BC 데이터시트

WED3C7410E16M400BC 데이터시트

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WED3C7410E16M400BC RISC Microprocessor Multichip Package WEDC
White Electronic Designs Corporation WEDC
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OVERVIEW
The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management.

The WED3C7410E16M-XBX multichip package consists of:
■ 7410E AltiVec™ RISC processor
■ Dedicated 2MB SSRAM L2 cache, confi gured as 256Kx72
■ 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA)
■ Maximum Core frequency = 400, 450MHz
■ Maximum L2 Cache frequency = 200MHz
■ Maximum 60x Bus frequency = 133MHz**

FEATURES
■ Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX
■ Implementation of Altivec™ technology instruction set
■ Optional, high-bandwidth MPX bus interface

 

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