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HCTS541HMSR 데이터 시트보기 (PDF) - Intersil
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HCTS541HMSR
Radiation Hardened Non-Inverting Octal Buffer/Line Driver, Three-State
Intersil
HCTS541HMSR Datasheet PDF : 10 Pages
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Die Characteristics
DIE DIMENSIONS:
101 x 85 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS541MS
HCTS541MS
A1 (3)
A2 (4)
A3 (5)
A4 (6)
A5 (7)
A6 (8)
(18) Y0
(17) Y1
(16) Y2
(15) Y3
(14) Y4
(13) Y5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS541 is TA14456A.
Spec Number
518630
691
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