MOC81113S 데이터 시트보기 (PDF) - Fairchild Semiconductor

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MOC81113S

6-PIN DIP OPTOCOUPLERS FOR POWER SUPPLY APPLICATIONS (NO BASE CONNECTION)

Fairchild Semiconductor 

MOC8111

6-PIN DIP OPTOCOUPLERS FOR

POWER SUPPLY APPLICATIONS

(NO BASE CONNECTION)

MOC8112

MOC8113

Package Dimensions (Through Hole)

PIN 1

ID.

0.270 (6.86)

0.240 (6.10)

0.070 (1.78)

0.045 (1.14)

0.350 (8.89)

0.330 (8.38)

0.200 (5.08)

0.135 (3.43)

0.154 (3.90)

0.100 (2.54)

0.022 (0.56)

0.016 (0.41)

0.100 (2.54)

TYP

0.020 (0.51)

MIN

0.016 (0.40)

0.008 (0.20)

0° to 15°

0.300 (7.62)

TYP

Package Dimensions (0.4” Lead Spacing)

Package Dimensions (Surface Mount)

0.350 (8.89)

0.330 (8.38)

3

2

1

PIN 1

ID.

0.270 (6.86)

0.240 (6.10)

4

5

6

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.165 (4.18)

0.022 (0.56)

0.016 (0.41)

0.020 (0.51)

MIN

0.100 (2.54)

TYP

Lead Coplanarity : 0.004 (0.10) MAX

0.300 (7.62)

TYP

0.016 (0.40) MIN

0.315 (8.00)

MIN

0.405 (10.30)

MAX

0.016 (0.41)

0.008 (0.20)

Recommended Pad Layout for

Surface Mount Leadform

0.270 (6.86)

0.240 (6.10)

0.350 (8.89)

0.330 (8.38)

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.135 (3.43)

0.154 (3.90)

0.100 (2.54)

0.022 (0.56)

0.016 (0.41)

0.004 (0.10)

MIN

0.100 (2.54) TYP

0.016 (0.40)

0.008 (0.20)

0° to 15°

0.400 (10.16)

TYP

NOTE

All dimensions are in inches (millimeters)

0.070 (1.78)

0.060 (1.52)

0.415 (10.54)

0.100 (2.54)

0.295 (7.49)

0.030 (0.76)

© 2004 Fairchild Semiconductor Corporation

Page 7 of 10

6/9/04

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