CNY173VM(2006) 데이터 시트보기 (PDF) - Fairchild Semiconductor

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CNY173VM
(Rev.:2006)

Phototransistor Optocouplers

Fairchild Semiconductor 

Black Package (No -M Suffix)

Package Dimensions (Through Hole)

PIN 1

ID.

0.270 (6.86)

0.240 (6.10)

0.070 (1.78)

0.045 (1.14)

0.350 (8.89)

0.330 (8.38)

0.200 (5.08)

0.115 (2.92)

0.154 (3.90)

0.100 (2.54)

0.022 (0.56)

0.016 (0.41)

0.100 (2.54)

TYP

0.020 (0.51)

MIN

0.016 (0.40)

0.008 (0.20)

0° to 15°

0.300 (7.62)

TYP

Package Dimensions (0.4” Lead Spacing)

PIN 1 ID

0.270 (6.86)

0.240 (6.10)

0.350 (8.89)

0.330 (8.38)

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.135 (3.43)

0.154 (3.90)

0.100 (2.54)

0.022 (0.56)

0.016 (0.41)

0.004 (0.10)

MIN

0.100 (2.54) TYP

0.016 (0.40)

0.008 (0.20)

0° to 15°

0.400 (10.16)

TYP

Note:

All dimensions are in inches (millimeters)

Package Dimensions (Surface Mount)

0.350 (8.89)

0.330 (8.38)

3

2

1

PIN 1

ID.

0.270 (6.86)

0.240 (6.10)

4

5

6

0.070 (1.78)

0.045 (1.14)

0.200 (5.08)

0.165 (4.18)

0.022 (0.56)

0.016 (0.41)

0.020 (0.51)

MIN

0.100 (2.54)

TYP

Lead Coplanarity : 0.004 (0.10) MAX

0.300 (7.62)

TYP

0.016 (0.40) MIN

0.315 (8.00)

MIN

0.405 (10.30)

MAX

0.016 (0.41)

0.008 (0.20)

Recommended Pad Layout for Surface Mount

Leadform (Black Package Only)

0.070 (1.78)

0.060 (1.52)

0.415 (10.54)

0.100 (2.54)

0.295 (7.49)

0.030 (0.76)

10

CNY17X, CNY17FX, MOC810X Rev. 1.0.6

www.fairchildsemi.com

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