DEVICE VARIATIONS
DEVICE VARIATIONS
Table 1. Device Peak Solder Temperature
Device
MC33981BHFK
MC33981ABHFK
Description (1)
Original BOM and lower Peak Package Temperature solderability.
Improved BOM and higher Peak Package Temperature solderability.
Notes
1. PPT values can be found on Freescale’s web site, or contact sales. Reference Peak Package Reflow
Temperature During Reflow(6), (7)
33981
2
Analog Integrated Circuit Device Data
Freescale Semiconductor