NCV8403A, NCV8403B
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage Internally Clamped
VDSS
42
Vdc
Gate−to−Source Voltage
VGS
"14
Vdc
Drain Current
Continuous
ID
Internally Limited
Total Power Dissipation − SOT−223 Version
@ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
Total Power Dissipation − DPAK Version
@ TA = 25°C (Note 1)
@ TA = 25°C (Note 2)
PD
W
1.13
1.56
1.32
2.5
Thermal Resistance − SOT−223 Version
Junction−to−Soldering Point
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
Thermal Resistance − DPAK Version
Junction−to−Soldering Point
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
RqJS
RqJA
RqJA
RqJS
RqJA
RqJA
°C/W
12
110
80
2.5
95
50
Single Pulse Inductive Load Switching Energy
(VDD = 25 Vdc, VGS = 5.0 V, IL = 2.8 A, L = 120 mH, RG = 25 W)
EAS
470
mJ
Load Dump Voltage (VGS = 0 and 10 V, RI = 2.0 W, RL = 4.5 W, td = 400 ms)
VLD
55
V
Operating Junction Temperature
TJ
−40 to 150
°C
Storage Temperature
Tstg
−55 to 150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Surface mounted onto minimum pad size (0.412″ square) FR4 PCB, 1 oz cu.
2. Mounted onto 1″ square pad size (1.127″ square) FR4 PCB, 1 oz cu.
+
ID
IG
+
VGS
GATE
DRAIN
SOURCE
VDS
−
−
Figure 1. Voltage and Current Convention
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