RT9001 데이터 시트보기 (PDF) - Richtek Technology
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RT9001 Datasheet PDF : 9 Pages
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RT9001
Where TJ(MAX) is the maximum junction temperature of the
die (125°C) and TA is the ambient temperature. The junction
to ambient thermal resistance (θJA) for SOT-223 package
at recommended minimum footprint is 160°C/W (θJA is
layout dependent). Visit our website in which
“Recommended Footprints for Soldering Surface Mount
Packages” for detail.
www.richtek.com
8
DS9001-04 March 2007
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