RT9006A/B
(a). Minimum Footprint, θJA = 75°C/W
(b). Copper Area = 10mm2, θJA = 64°C/W
(c). Copper Area = 30mm2, θJA = 54°C/W
(d). Copper Area = 50mm2, θJA = 51°C/W
(e). Copper Area = 70mm2, θJA = 49°C/W
Figure 2. Thermal Resistance vs. Copper Area Layout Design
DS9006A/B-05 September 2007
www.richtek.com
9