TS482 데이터 시트보기 (PDF) - STMicroelectronics

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TS482

100mW Stereo Headphone Amplifier

STMicroelectronics 

Package Mechanical Data

3 Package Mechanical Data

TS482

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages.

These packages have a Lead-free second level interconnect. The category of second level

interconnect is marked on the package and on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:

www.st.com.

3.1

SO-8 Package

SO-8 MECHANICAL DATA

DIM.

A

A1

A2

B

C

D

E

e

H

h

L

k

ddd

MIN.

1.35

0.10

1.10

0.33

0.19

4.80

3.80

5.80

0.25

0.40

mm.

TYP

1.27

MAX.

1.75

0.25

1.65

0.51

0.25

5.00

4.00

MIN.

0.053

0.04

0.043

0.013

0.007

0.189

0.150

6.20

0.228

0.50

0.010

1.27

0.016

8˚ (max.)

0.1

inch

TYP.

0.050

MAX.

0.069

0.010

0.065

0.020

0.010

0.197

0.157

0.244

0.020

0.050

0.04

23/26

0016023/C

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