Diode Semiconductor Korea BYG20D---BYG20J
ULTRA FAST SMD RECTIFIERS
FEATURES
◇ For surface mounted applications
◇ Glass passivated junction
◇ Low forward voltage drop
◇ High current capability
◇ Easily cleaned with Alcohol,Isopropnol
and similar solvents
◇ The plastic material carries U/L
recognition 94V-0
MECHANICAL DATA
◇ Case: JEDEC SMA,molded plastic
◇ Terminals: Solder plated, solderable per
MIL- STD-202,Method 208
◇ Polarity: Color band denotes cathode end
◇ Weight: 0.002 ounces, 0.064 grams
◇ Mounting position: Any
VOLTAGE RANGE: 200 -- 600V
CURRENT: 1.5 A
SMA
4.5± 0.1
5.1± 0.2
1.3± 0.2
0.2± 0.05
Dimensions in millimeters
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified.
Single phase,half wave,50 Hz,resistive or inductive load. For capacitive load,derate by 20%.
BYG20D
BYG20G
BYG20J UNITS
Maximum recurrent peak reverse voltage
VRRM
200
Maximum RMS voltage
VRMS
140
Maximum DC blocking voltage
VDC
200
Average forward rectified current
IF(AV)
400
280
400
1.5
600
V
420
V
600
V
A
Peak forward surge current
10 ms single half-sine-wave
IFSM
30
A
superimposed on rated load
Maximum instantaneous
forward voltage
@ 1.0 A
@ 1.5 A
VF
1.3
1.4
V
Maximum reverse current @TA=25℃
at rated DC blocking voltage @TA=100℃
IR
1.0
10
µA
Reverse recovery time (Note1)
trr
75
ns
Typical thermal resistance (Note2)
RthJL
25
K/W
Typical thermal resistance (Note3)
RthJA
125
K/W
Operating temperature range
Tj
- 55 -- +150
℃
Storage temperature range
TSTG
- 55 -- +150
℃
NOTE: 1. Reverse recovery test conditions: IF=0.5A,IR=1.0A,Irr=0.25A.
2. Thermal resistance from junction to lead.
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3. Thermal resistance from junction to ambient.mounted on epoxy-glass hard tissue,50mm 2 35µm Cu.