1M / 2M / 4M-BIT SERIAL FLASH MEMORY with 40MHz SPI
NX25P10, NX25P20 AND NX25P40
PACKAGING INFORMATION
8-Pin SOIC 150-mil (Package Code N)
1
D
CP
E1 E
b
SEATING PLANE
A2 A
e
A1
L
α
C
Package Dimensions(1)
Symbol
A
A1
A2
b
C
D(3)
E
E1(3)
e(2)
L
α
CP
Millimeters
Min Typ. Max
1.47 1.60 1.72
0.10
0.24
1.45
0.33 0.41 0.50
0.19 0.20 0.25
4.80 4.85 4.95
5.80 6.00 6.19
3.80 3.90 4.00
1.27 BSC
0.40 0.71 1.27
0o
8o
0.10
Inches
Min Typ. Max
0.058 0.063 0.068
0.004
0.009
0.057
0.013 0.016 0.020
0.0075 0.008 0.0098
0.189 0.191 0.195
0.228 0.236 0.244
0.150 0.154 0.157
0.050 BSC
0.015 0.028 0.050
0o
8o
0.004
Notes:
1. Controlling dimensions: inches,
unless otherwise specified.
2. BSC = Basic lead spacing between
centers.
3. Dimensions D and E1 do not include
mold flash protrusions and should
be measured from the bottom of the
package.
4. Formed leads shall be planar with
respect to one another within .0004
inches at the seating plane.
26
NexFlash Technologies, Inc.
PRELIMINARY MKP-0009 Rev 6 NXSF040I-0405
04/04/05 ©