HMC8142 데이터 시트보기 (PDF) - Analog Devices
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HMC8142 Datasheet PDF : 16 Pages
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HMC8142
Data Sheet
OUTLINE DIMENSIONS
0.114
0.200
0.200 0.200
4
5
6
7
0.600
3.039
0.200
0.600
0.200
8
9
10
11
0.764
0.089
0.168
0.05
0.130
3
2
0.130
1
12
1.999
13
14
0.764
0.106
25 24 23 22
0.09
0.003
0.200 0.200 0.200
21 20 19 18
17 16 15
0.191
0.600
0.200 0.200 0.200
TOP VIEW
(CIRCUIT SIDE)
0.600
0.200 0.200
0.014
SIDE VIEW
ORDERING GUIDE
Model1
HMC8142
HMC8142-SX
Figure 43. 25-Pad Bare Die [CHIP]
(C-25-2)
Dimensions shown in millimeters
Temperature Range
−55°C to +85°C
−55°C to +85°C
Package Description
25-Pad Bare Die [CHIP]
25-Pad Bare Die [CHIP]
1 The HMC8142-SX consists of two pairs of the die in a gel pack for sample orders.
2 This is a waffle pack option; contact Analog Devices, Inc., sales representatives for additional packaging options.
Package Option2
C-25-2
C-25-2
©2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13425-0-2/16(A)
Rev. A | Page 16 of 16
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