Nexperia
BAS70 series; 1PS7XSB70 series
General-purpose Schottky diodes
Footprint information for reflow soldering of plastic surface-mounted, 2 leads package
SOD123F
4.4
2.9
2.8
2.1 1.6
1.1
(2×)
1.2
(2×)
solder land
solder land plus solder paste
solder paste deposit
occupied area
solder resist
Dimensions in mm
Fig. 19. Reflow soldering footprint SOD123F
1.3
0.7
R0.05 (8×)
0.9
0.6 0.7 0.8
(2×) (2×) (2×)
0.3
(2×)
0.4
(2×)
0.5
(2×)
Fig. 20. Reflow soldering footprint SOD882
1.1 1.2
(2×) (2×)
sod123f_fr
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
sod882_fr
BAS70_1PS7XSB70_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 10 — 7 April 2021
© Nexperia B.V. 2021. All rights reserved
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