R
SEMICONDUCTOR
MM1Z5221B THRU MM1Z5268B
0.5W SILICON PLANAR ZENER DIODES
FEATURES
Total power dissipation:max.500 mW
Small plastic package suitable for surface mounted design
Tolerance approximately ±5%
High temperature soldering guaranteed:260℃/10 seconds at terminals
Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
MECHANICAL DATA
Case: SOD-123 plastic case
Weight: Approx. 0.01 gram
SOD-123
(0.55
+0.05
-0.05
)
0.022"+-00..000022""
JF
(2.65±0.05
0.104"+-0.002
0.005"(0.135)
MAX
(3.8±0.1)
0.150"±0.004" 5°
(1.60+-00..0055 )
0.063"+-00..000022""
(1.10±0.05)
0.043"±0.002"
Dimensions in inches and (millimeters)
ABSOLUTE MAXIMUM RATINGS(LIMITING VALUES) (TA=25 C)
Zener current see table "Characteristics"
Power dissipation
Junction temperature
Storage temperature range
Symbols
PD
TJ
TSTG
Value
500
150
-55 to+150
Units
mW
C
C
ELECTRICAL CHARACTERISTICS (TA=25 C)
Thermal resistance junction to ambient
Thermal resistance junction to Lead
Forward voltage at IF=10mA
Symbols
Min
RθJA
RθJL
VF
Typ
Max
Units
340
C/W
150
C/W
0.9
V
JINAN JINGHENG ELECTRONICS CO., LTD.
10-47
HTTP://WWW.JINGHENGGROUP.COM