P/N + 설명 + 콘텐츠 검색
Compensated Devices => Microsemi
상세내역 : 1 WATT CAPABILITY WITH PROPER HEAT SINKING
Compensated Devices => Microsemi
상세내역 : 1 WATT CAPABILITY WITH PROPER HEAT SINKING
Compensated Devices => Microsemi
상세내역 : 1 WATT CAPABILITY WITH PROPER HEAT SINKING
Compensated Devices => Microsemi
상세내역 : 1 WATT CAPABILITY WITH PROPER HEAT SINKING
부품명(s) : S102S03 S202S03
Sharp Electronics
상세내역 : SIP Type SSR WITH Mounting CAPABILITY for External HEAT Sink
Sharp Electronics
상세내역 : SIP Type SSR WITH Mounting CAPABILITY for External HEAT Sink
부품명(s) : S102S11 S202S11 S202S12 S102S12
Sharp Electronics
상세내역 : SIP Type SSR WITH Snubber Circuit and Mouning CAPABILITY for External HEAT Sink (Rev - V2)
부품명(s) : 2100TR
Systemsensor advanced ideas.
상세내역 : Photoelectronic Smoke Detector WITH Fixed HEAT
부품명(s) : IXRH50N120 IXRH50N100
IXYS CORPORATION
상세내역 : IGBT WITH Reverse Blocking CAPABILITY
부품명(s) : 50N60 50N80 IXRH50N60 IXRH50N80
IXYS CORPORATION
상세내역 : IGBT WITH Reverse Blocking CAPABILITY
부품명(s) : HFA3665 HFA3665IA HFA3665IA96
Intersil
상세내역 : CDMA/AMPS Downconverter WITH AGC CAPABILITY
부품명(s) : TAT-125-3 TAT-125-3/16-0-STK
TE Connectivity
상세내역 : HEAT Shrink Tubing
NEC => Renesas Technology
상세내역 : HIGH HEAT RESISTIVITY
부품명(s) : EP1F EP2F EP2F-B3L1 EP2F-B3L1T EP2F-B3L1S EP2F-B3L1ST EP2F-B3L2 EP2F-B3L2T EP2F-B3L2S EP2F-B3L2ST
NEC => Renesas Technology
상세내역 : HIGH HEAT RESISTIVITY
부품명(s) : MC68HC05M9
Motorola => Freescale
상세내역 : microcomputer unit WITH VFD drive CAPABILITY
부품명(s) : IXSN80N60BD1
IXYS CORPORATION
상세내역 : IGBT WITH Diode Short Circuit SOA CAPABILITY
부품명(s) : 2400AT 2400AIT
Systemsensor advanced ideas.
상세내역 : Direct Wire Photoelectronic WITH Fixed HEAT Smoke Detectors
Aavid Thermalloy, LLC
상세내역 : Channel style HEAT sink WITH folded back fins
Unspecified
상세내역 : Master HEAT Guns & Kits
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