WM8181
PACKAGE DIMENSIONS
DW: 16 PIN SOICW 7.5mm (0.3") Wide Body, 1.27mm Lead Pitch
e
16
B
9
Advanced Information
DM019.A
EH
1
8
D
L
h x 45o
A1 SEATING PLANE
-C-
α
A
0.10 (0.004)
C
Symbols
A
A1
B
C
D
e
E
h
H
L
α
Dimensions
(mm)
MIN
MAX
2.35
2.65
0.10
0.30
0.33
0.51
0.23
0.32
10.10
10.50
1.27 BSC
7.40
7.60
0.25
0.75
10.00
10.65
0.40
0o
1.27
8o
Dimensions
(Inches)
MIN
MAX
0.0926
0.1043
0.0040
0.0118
0.0130
0.0200
0.0091
0.0125
0.3465
0.3622
0.0500 BSC
0.2914
0.2992
0.0100
0.0290
0.3940
0.4190
0.0160
0o
0.0500
8o
REF:
JEDEC.95, MS-013
NOTES:
A. ALL LINEAR DIMENSIONS ARE IN MILLIMETERS (INCHES).
B. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
C. BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSION, NOT TO EXCEED 0.25MM (0.010IN).
D. MEETS JEDEC.95 MS-013, VARIATION = AA. REFER TO THIS SPECIFICATION FOR FURTHER DETAILS.
WOLFSON MICROELECTRONICS LTD
AI Rev 3.0 January 2000
14