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CXA2055P 데이터 시트보기 (PDF) - Sony Semiconductor

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CXA2055P Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
Package Outline Unit : mm
28PIN DIP (PLASTIC)
+ 0.4
37.8 – 0.1
28
15
1
14
2.54
CXA2055P
0° to 15°
0.5 ± 0.1
1.2 ± 0.15
Two kinds of package surface:
1.All mat surface type.
2.Center part is mirror surface.
SONY CODE
EIAJ CODE
JEDEC CODE
DIP-28P-03
DIP028-P-0600
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
4.2g
—20—

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