DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

CXA2067 데이터 시트보기 (PDF) - Sony Semiconductor

부품명
상세내역
제조사
CXA2067 Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
Package Outline Unit : mm
30PIN SDIP (PLASTIC)
+ 0.4
26.9 – 0.1
30
16
1
15
1.778
CXA2067AS
0° to 15°
0.5 ± 0.1
0.9 ± 0.15
SONY CODE
EIAJ CODE
JEDEC CODE
SDIP-30P-01
SDIP030-P-0400
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
PACKAGE STRUCTURE
MOLDING COMPOUND EPOXY RESIN
LEAD TREATMENT
SOLDER/PALLADIUM
PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
1.8g
—18—

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]