UPC8105GR 데이터 시트보기 (PDF) - NEC => Renesas Technology
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UPC8105GR Datasheet PDF : 16 Pages
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µPC8105GR
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electrostatic sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation).
(3) Keep the track length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin.
(5) I, Q DC offset voltage should be same as the I, Q DC offset voltage (to prevent changing the local leak level with
power save control.)
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
µPC8105GR
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering Conditions
Peak package’s surface temperature: 235 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 3, Exposure limit*: None
Peak package’s surface temperature: 215 °C or below,
Reflow time: 30 seconds or below (200 °C or higher),
Number of reflow process: 3, Exposure limit*: None
Solder temperature: 260 °C or below
Flow time: 10 seconds or below,
Number of reflow process: 1, Exposure limit*: None
Terminal temperature: 300 °C or below
Flow time: 3 seconds/pin or below,
Exposure limit*: None
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
*: Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 °C and relative humidity at 65 % or less.
Note: Apply only a single process at once, except for “Partial heating method”.
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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Data Sheet P10807EJ3V0DS00
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