RF3321 데이터 시트보기 (PDF) - RF Micro Devices
부품명
상세내역
제조사
RF3321 Datasheet PDF : 16 Pages
| |||
Preliminary
Special Handling Information for Shrunk Small
Outline Package (SSOP1-EPP) Products
These packages are considered JEDEC Level 5 for
moisture sensitivity and require special handling to
assure reliable performance.
The exposed copper slug on the bottom of the package
improves both thermal and electrical performance.
Since the RFIC is mounted directly on the thermal
slug, and the slug is soldered directly on the PCB, the
thermal resistance to the PCB is minimized. Also, the
RF ground for the amplifier is established through this
copper slug as it is soldered to the ground plane on the
PCB. This offers the least inductance ground path
available.
Care must be taken when soldering these packages to
the PCB. They are currently considered JEDEC Level
5 for moisture sensitivity. Therefore the parts must be
handled in a dry environment prior to soldering, as is
specified in the JEDEC specification. Specifically,
RFMD recommends the following procedure prior to
assembly:
1. Dry-bake the parts at 125°C for 24 hours minimum.
Note: the shipping tubes cannot withstand 125°C
baking temperature.
2. Parts delivered on tape and reel are already dry-
baked and dry-packed. These may be stored for up
to one year, but must be assembled within 48 hours
after opening the bag.
3. Assemble the dry-baked parts within two days of
removal from the oven.
4. During this two-day period, the parts must be stored
in humidity less than 60%.
IMPORTANT!
If the two-day period is exceeded, then this procedure
must be repeated prior to assembly.
RF3321
3
Rev A10 010516
2-16
Share Link: 