CXD1185CQ 데이터 시트보기 (PDF) - Sony Semiconductor

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CXD1185CQ

SCSI 1 Protocol Controller

Sony Semiconductor 

Package Outline Unit : mm

CXD1185CQ

51

52

64PIN QFP(PLASTIC)

23.9 ± 0.4

+ 0.4

20.0 – 0.1

33

32

+ 0.1

0.15 – 0.05

0.15

64

1

1.0

20

19

+ 0.15

0.4 – 0.1

+ 0.35

2.75 – 0.15

0.24 M

+ 0.2

0.1 – 0.05

CXD1185CR

SONY CODE

EIAJ CODE

JEDEC CODE

QFP-64P-L01

QFP064-P-1420

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

EPOXY RESIN

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

PACKAGE MASS

1.5g

64PIN LQFP (PLASTIC)

12.0 ± 0.2

∗ 10.0 ± 0.1

48

33

49

32

64

1

0.5

16

+ 0.08

0.18 – 0.03

17

(0.22)

0.13 M

0.1 ± 0.1

A

+ 0.2

1.5 – 0.1

+ 0.05

0.127 – 0.02

0.1

SONY CODE

EIAJ CODE

JEDEC CODE

0° to 10°

DETAIL A

LQFP-64P-L01

LQFP064-P-1010

NOTE: Dimension “∗” does not include mold protrusion.

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

LEAD MATERIAL

SOLDER/PALLADIUM

PLATING

42/COPPER ALLOY

PACKAGE MASS

0.3g

—35—

CXD1185CQ/CR

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