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LSYA676-P-P 데이터 시트보기 (PDF) - Infineon Technologies

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LSYA676-P-P
Infineon
Infineon Technologies Infineon
LSYA676-P-P Datasheet PDF : 12 Pages
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Empfohlenes Lötpaddesign IR Reflow Löten
Recommended Solder Pad IR Reflow Soldering
4.2 (0.165)
LSY A676
1.7 (0.067)
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Pick up Area
Lötstopplack
Solder resist
Cu Fläche > 16 mm 2 per pad
Cu-area
OHPY1302
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gurtung / Polarität und Lage
Verpackungseinheit 2000/Rolle, ø330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, ø330 mm
1.5 (0.059)
4 (0.157)
2 (0.079)
C
A
4.25 (0.167)
8 (0.315)
Cathode identification
OHAY2273
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-05-07
11

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