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ADG467(Rev0) 데이터 시트보기 (PDF) - Analog Devices

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ADG467
(Rev.:Rev0)
ADI
Analog Devices ADI
ADG467 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
ADG466/ADG467
ABSOLUTE MAXIMUM RATINGS1
PIN CONFIGURATIONS
(TA = +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
VS, VD, Analog Input Overvoltage with Power ON2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS – 20 V to VDD + 20 V
VS, VD, Analog Input Overvoltage with Power OFF2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –35 V to +35 V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
8-Lead
DIP, SOIC
and SOIC
VD1 1
8 VDD
VD2 2 ADG466 7 VS1
TOP VIEW
VD3 3 (Not to Scale) 6 VS2
18-Lead
SOIC
VD1 1
VD2 2
VD3 3
18 VDD
17 VS1
16 VS2
(Pulsed at 1 ms, 10% Duty Cycle Max)
VSS 4
5 VS3
VD4 4 ADG467 15 VS3
Operating Temperature Range
VD5 5 TOP VIEW 14 VS4
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
(Not to Scale)
VD6 6
13 VS5
Storage Temperature Range . . . . . . . . . . . . . –65°C to +125°C
VD7 7
12 VS6
OBSOLETE Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
µSOIC Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SSOP Package
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 130°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
VD8 8
VSS 9
20-Lead
SSOP
VD1 1
20 NC
VD2 2
19 VDD
VD3 3
18 VS1
VD4 4
17 VS2
VD5 5 ADG467 16 VS3
VD6
6
TOP VIEW
(Not to Scale)
15
VS4
VD7 7
14 VS5
VD8 8
13 VS6
VSS 9
12 VS7
11 VS7
10 VS8
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NC 10
11 VS8
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
NC = NO CONNECT
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Only one absolute maximum rating may be applied at any one time.
2Overvoltages at S or D will be clamped by the channel protector, see “Circuit
Information” section of the data sheet.
ORDERING GUIDE
Model
ADG466BN
ADG466BR
ADG466BRM
ADG467BR
ADG467BRS
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
8-Lead Plastic DIP
8-Lead Small Outline Package
8-Lead Micro Small Outline Package
18-Lead Small Outline Package
20-Lead Shrink Small Outline Package
Package Option
N-8
SO-8
RM-8
R-18
RS-20
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG466/ADG467 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–3–

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