CXA2064M 데이터 시트보기 (PDF) - Sony Semiconductor
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CXA2064M Datasheet PDF : 21 Pages
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Package Outline
Unit: mm
30PIN SOP(PLASTIC)
+ 0.4
18.8 – 0.1
30
16
+ 0.4
2.3 – 0.15
0.1
+ 0.2
0.1 – 0.05
A
1
0.45 ± 0.1
0.2 M
15
1.27
+ 0.1
0.2 – 0.05
SCT Ass'y
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
30
SOP-30P-L03
SOP030-P-0375
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.7g
30PIN SOP(PLASTIC)
+ 0.4
18.8 – 0.1
16
+ 0.4
2.3 – 0.15
0.1
+ 0.2
0.1 – 0.05
A
1
0.45 ± 0.1
0.2 M
15
1.27
+ 0.1
0.2 – 0.05
0° to 10°
DETAIL A
SONY CODE
EIAJ CODE
JEDEC CODE
SOP-30P-L03
SOP030-P-0375
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.7g
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SPEC.
COPPER ALLOY
Sn-Bi Bi:1-4wt%
5-18µm
– 21 –
CXA2064M
Sony Corporation
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