SG1525A 데이터 시트보기 (PDF) - Microsemi Corporation

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SG1525A

Regulating Pulse Width Modulator

Microsemi Corporation 

Absolute Maximum Ratings1

Parameter

Supply Voltage (+VIN)

Collector Supply Voltage (VC)

Logic Inputs

Analog Inputs

Output Current, Source or Sink

Reference Load Current

Oscillator Charging Current

Operating Junction Temperature

Hermetic (J, L Packages)

Plastic (N, DW Packages)

Storage Temperature Range

Lead Temperature (Soldering, 10 seconds)

RoHS Peak Package Solder Reflow Temp. (40 s max. exp.)

Note: Values beyond which damage may occur

Absolute Maximum Ratings1

Value

40

40

-0.3 to 5.5

-0.3 to VIN

500

50

5

150

150

-65 to 150

300

260 (+0, -5)

Units

V

V

V

V

mA

mA

mA

°C

°C

°C

°C

°C

Thermal Data

Parameter

Value

Units

J Package

Thermal Resistance-Junction to Case, θJC

30

°C/W

Thermal Resistance-Junction to Ambient, θJA

80

°C/W

N Package

Thermal Resistance-Junction to Case, θJC

40

°C/W

Thermal Resistance-Junction to Ambient, θJA

65

°C/W

DW Package

Thermal Resistance-Junction to Case, θJC

40

°C/W

Thermal Resistance-Junction to Ambient, θJA

95

°C/W

L Package

Thermal Resistance-Junction to Case, θJC

35

°C/W

Thermal Resistance-Junction to Ambient, θJA

120

°C/W

Notes:

1. Junction Temperature Calculation: TJ = TA + (PD × θJA).

2. The above numbers for θJC are maximums for the limiting thermal resistance of the package in a standard mounting

configuration. The θJA numbers are meant to be guidelines for the thermal performance of the device/pc-board system. All of

the above assume no ambient airflow.

3

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