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MT1389 데이터 시트보기 (PDF) - Unspecified

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MT1389 Datasheet PDF : 40 Pages
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Specifications are subject to change without notice
13 Solder-Reflow Condition
13-1 Reflow Condition
MediaTek can guarantee 3 times IR reflow based on the reflow profile (Figure 1).
Average ramp-up rate (Ts to peak): 3 oC /sec. max.
Preheat & Soak: Pb-Free 150~200 oC (SnPb Eutectic 100~150 oC) for 60~120 seconds
Liquidous temperature maintained above Pb-Free 217 oC (SnPb Eutectic 183 oC) for 60~150 seconds
Time within 5 oC of specified classification temperature: Pb-Free 30 seconds (SnPb Eutectic 20 seconds)
ly Note:
n Reflow profiles in this document are for classification/preconditioning and are not meant to specify
l O board assembly profiles. Actual board assembly profiles should be developed based on specific
tia process needs and board designs and should not exceed the parameters in Table 1.
k For example, if Tc is 260 oC and time tp is 30 seconds, this means the following for the supplier and
n e user.
e T For a supplier: The peak temperature must be at least 260 oC. The time above 255 oC must be at
fid e least 30 seconds.
in For a user: The peak temperature must not exceed 260 oC. The time above 255 oC must not exceed
n g 30 seconds.
o n re Peak temperature: Defined in Table 2-1 and Table 2-2.
C iE u Ramp-down rate: 6 oC /sec. max.
K ig s Time 25 oC to peak temperature: Pb-Free: 8 minutes max. (SnPb Eutectic 6 minutes max.)
MTForNDo Disclo Time between reflows: 5 minutes minimum and 60 minutes maximum
38
MEDIATEK CONFIDENTIAL, NO DISCLOSURE

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