ADCMP603
Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
3.10
3.00 SQ
2.90
0.80
0.75
0.70
SEATING
PLANE
TOP VIEW
0.50
BSC
0.30
0.23
0.18
10
12
9
1
EXPOSED
PAD
7
3
PIN 1
INDICATOR
1.65
1.50 SQ
1.35
0.50
6
4
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.20 REF
ORDERING GUIDE
Model1
ADCMP603BCPZ-WP
ADCMP603BCPZ-R2
ADCMP603BCPZ-R7
COMPLIANT TO JEDEC STANDARDS MO-220-WEED.
Figure 25. 12-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-12-5)
Dimensions shown in millimeters
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
12-Lead Lead Frame Chip Scale Package [LFCSP]
12-Lead Lead Frame Chip Scale Package [LFCSP]
12-Lead Lead Frame Chip Scale Package [LFCSP]
1 Z =RoHS Compliant Part.
Package Option
CP-12-5
CP-12-5
CP-12-5
Branding
G0D
G0D
G0D
Rev. A | Page 14 of 16