RDA Microelectronics, Inc.
10. Solder Mounting Condition
RDA1846 SPEC V1.2e
Classification Reflow Profile
Table 10-1 Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
Average Ramp-Up Rate
(TSmax to Tp)
Preheat
-Temperature Min (Tsmin)
-Temperature Max (Tsmax)
-Time (tsmin to tsmax)
Time maintained above:
-Temperature (TL)
-Time (tL)
Peak /Classification
Temperature(Tp)
Time within 5 oC of actual
Peak Temperature (tp)
Ramp-Down Rate
3 oC/second max.
100 oC
100 oC
60-120 seconds
183 oC
60-150seconds
See Table-II
10-30 seconds
6 oC/second max.
3 oC/second max.
150 oC
200 oC
60-180 seconds
217oC
60-150 seconds
See Table-III
20-40 seconds
6 oC/seconds max.
Time 25 oC to Peak
Temperature
6 minutes max.
8 minutes max.
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