24C64 데이터 시트보기 (PDF) - STMicroelectronics

부품명

상세내역

제조사

24C64

64-Kbit serial I²C bus EEPROM

STMicroelectronics 

M24C64-W M24C64-R M24C64-F

Figure 23. Thin WLCSP 8-bump wafer-length chip-scale package outline

(M24C64-DFCT6TP/K)

$

89

%

$ETAIL!

(

&

E

E

E

2EFERENCE

AAA

8

7AFERBACKSIDE

"UMP

!

!

3IDEVIEW

E

&

/RIENTATION '

REFERENCE

"UMPSSIDE

EEE :

!

B

$ETAIL!

2OTATED

:

3EATINGPLANE

#I?-%?6

1. Drawing is not to scale.

2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).

Table 24. Thin WLCSP 8-bump wafer-length chip-scale package mechanical data

(M24C64-DFCT6TP/K)

Symbol

millimeters

Typ

Min

Max

inches(1)

Typ

Min

Max

A

0.315

0.300 0.330 0.0124

0.0118

0.0130

A1

0.115

0.0045

A2

0.200

b(2)

0.160

0.0079

0.0063

D

1.073

1.093 0.0422

0.0430

E

0.959

0.979 0.0378

0.0385

e

0.693

0.0273

e1

0.800

0.0315

e2

0.400

0.0157

F

0.133

0.0052

G

0.137

0.00524

aaa

0.110

0.0043

eee

0.060

0.0043

1. Values in inches are converted from mm and rounded to four decimal digits.

2. Dimension measured at the maximum bump diameter parallel to primary datum Z.

DocID16891 Rev 30

39/45

44

Share Link: