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33981B 데이터 시트보기 (PDF) - Freescale Semiconductor

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33981B Datasheet PDF : 37 Pages
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FUNCTIONAL DEVICE OPERATION
PROTECTION AND DIAGNOSTIC FEATURES
directly but rather its effects on the low side MOSFET. When
VDLS > VOCLS, the GLS pin goes to 0V and the OCLS internal
current source is disconnected and OCLS goes to 0V. The
GLS pin and the OCLS pin are reset (and the fault is
delatched) by a logic [0] at the INLS pin for at least tRST(DIAG).
Figure 13 and Figure 14 illustrate the behavior in case of
overload on Low Side Gate driver.
When connected to an external resistor, the OCLS pin with
its internal current source sets the VOCLS level. By changing
the external resistance, the protection level can be adjusted
depending on low side characteristics. A 33 kΩ resistor gives
a VDS level of 3.3 V typical.
This protection circuitry measures the voltage between the
drain of the low side (DLS pin) and the 33981 ground (GND
pin). For this reason it is key that the low side source, the
33981 ground, and the external resistance ground
connection are connected together in order to prevent false
error detection due to ground shifts.
The maximum OCLS voltage being 4.0 V, a resistor bridge
on DLS must be used to detect a higher voltage across the
low side.
CONFIGURATION
The CONF pin manages the cross-conduction between
the internal MOSFET and the external low side MOSFET.
With the CONF pin at 0V, the two MOSFETs can be
independently controlled. A load can be placed between the
high side and the low side.
With the CONF pin at 5.0 V, the two MOSFETs cannot be
on at the same time. They are in half-bridge configuration as
shown in the simplified application diagram on page 1. If
INHS and INLS are at 5.0 V at the same time, INHS has
priority and OUT will be at VPWR. If INHS changes from 5.0 V
to 0 V with INLS at 5.0 V, GLS will go to high state as soon
as the VGS of the internal MOSFET is lower than 2.0 V
typically. A half-bridge application could consist in sending
PWM signal to the INHS pin and 5.0 V to the INLS pin with
the CONF pin at 5.0 V.
Figure 20, illustrates the simplified application diagram on
page 1 with a DC motor and external low side. The CONF
and INLS pins are at 5.0 V. When INHS is at 5.0 V, current is
flowing in the motor. When INHS goes to 0 V, the load current
recirculates in the external low side.
BOOTSTRAP SUPPLY
Bootstrap supply provides current to charge the bootstrap
capacitor through the VPWR pin. A short time is required after
the application of power to the device to charge the bootstrap
capacitor. A typical value for this capacitor is 100 nF. An
internal charge pump allows continuous MOSFET drive.
When the device is in the sleep mode, this bootstrap supply
is off to minimize current consumption.
HIGH SIDE GATE DRIVER
The high side gate driver switches the bootstrap capacitor
voltage to the gate of the MOSFET. The driver circuit has a
low-impedance drive to ensure that the MOSFET remains
OFF in the presence of fast falling dV/dt transients on the
OUT pin.
This bootstrap capacitor connected between the power
supply and the CBOOT pin provides the high pulse current to
drive the device. The voltage across this capacitor is limited
to about 13 V typical.
An external capacitor connected between pins SR and
GND is used to control the slew rate at the OUT pin. Figure 9
and Figure 10 give VOUT rise and fall time versus different SR
capacitors.
LOW SIDE GATE DRIVER
The low side control circuitry is PWM capable. It can drive
a standard MOSFET with an RDS(ON) as low as 10.0 mΩ at a
frequency up to 60 kHz. The VGS is internally clamped at
12 V typically to protect the gate of the MOSFET. The GLS
pin is protected against short by a local over temperature
sensor.
THERMAL FEEDBACK
The 33981 has an analog feedback output (TEMP pin) that
provides a value in inverse proportion to the temperature of
the GND flag (pin 13). The controlling microcontroller can
“read” the temperature proportional voltage with its analog-
to-digital converter (ADC). This can be used to provide real-
time monitoring of the PC board temperature to optimize the
motor speed and to protect the whole electronic system.
TEMP pin value is VTFEED with a negative temperature
coefficient of DTFEED.
REVERSE BATTERY
The 33981 survives the application of reverse battery
voltage as low as -16 V. Under these conditions, the output’s
gate is enhanced to decrease device power dissipation. No
additional passive components are required. The 33981
survives these conditions until the maximum junction rating is
reached.
In the case of reverse battery in a half-bridge application,
a direct current passes through the external freewheeling
diode and the internal high side.
As Figure 11 shows, it is essential to protect this power
line. The proposed solution is an external N-channel low side
with its gate tied to battery voltage through a resistor. A high
side in the VPWR line could be another solution.
33981
14
Analog Integrated Circuit Device Data
Freescale Semiconductor

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