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HCTS109K/SAMPLE 데이터 시트보기 (PDF) - Intersil
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HCTS109K/SAMPLE
Radiation Hardened Dual JK Flip Flop
Intersil
HCTS109K/SAMPLE Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
89 x 88 mils
2.25 X 2.24mm
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
J1
(2)
HCTS109MS
HCTS109MS
R1
VCC
(1)
(16)
K1 (3)
CP1 (4)
S1 (5)
Q1 (6)
(15) R2
(14) J2
(13) K2
(12) CP2
Q1 (7)
(11) S2
(8)
GND
(9)
(10)
Q2
Q2
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS109 is TA14440A.
Spec Number
518601
18
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