DVI/HDMI TMDS FR-4 and
Cable Equalizer/Driver
Pin Configuration
TOP VIEW
24 23 22 21 20 19 18 17
VEE 25
OUTA- 26
OUTA+ 27
VEE 28
LEVEL 29
INA+ 30
INA- 31
VCC 32
+
MAX3814
1 2345678
16 VEE
15 OUTD+
14 OUTD-
13 VEE
12 ENABLE
11 IND-
10 IND+
9 VCC
TQFP
(5mm × 5mm × 1.0mm)
Chip Information
PROCESS: SiGe BiPOLAR
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE
TYPE
32 TQFP
PACKAGE
CODE
H32+1
OUTLINE
LAND
NO. PATTERN NO.
21-0110
90-0149
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