TEA1533AP 데이터 시트보기 (PDF) - Philips Electronics

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TEA1533AP

GreenChip™II SMPS control IC

Philips Electronics 

Philips Semiconductors

GreenChipTMII SMPS control IC

PACKAGE OUTLINE

DIP8: plastic dual in-line package; 8 leads (300 mil)

Product specification

TEA1533P; TEA1533AP

SOT97-1

D

L

Z

e

b

8

A2 A

A1

wM

b1

b2

5

pin 1 index

E

ME

c

(e 1)

MH

1

4

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

A

max.

A1

min.

A2

max.

b

b1

b2

c

D (1)

E (1)

e

e1

L

ME

MH

w

Z (1)

max.

mm

4.2

0.51

3.2

1.73 0.53

1.14 0.38

1.07 0.36

0.89 0.23

9.8

9.2

6.48

6.20

2.54

7.62

3.60

3.05

8.25

7.80

10.0

8.3

0.254

1.15

inches 0.17

0.020

0.13

0.068 0.021 0.042 0.014

0.045 0.015 0.035 0.009

0.39

0.36

0.26

0.24

0.10

0.30

0.14

0.12

0.32

0.31

0.39

0.33

0.01 0.045

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

SOT97-1

IEC

050G01

REFERENCES

JEDEC

EIAJ

MO-001

SC-504-8

EUROPEAN

PROJECTION

ISSUE DATE

95-02-04

99-12-27

2002 Aug 23

18

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