TP
TL
Tsmax
tp
RAMP UP
tL
Tsmin
ts
PREHEAT
RAMP DOWN
25
t 25°C TO PEAK
TIME
Figure 19. Typical SMT reflow profile for maximum temperature = 260 +0/-5°C
CRITICAL ZONE
TL TO TP
Table 7. Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C
Profile Feature
Average Ramp-Up Rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Min to Max) (ts)
Tsmax to TL
- Ramp-Up Rate
Time Maintained Above:
- Temperature (TL)
- Time (TL)
Peak Temperature (Tp)
Time Within 5°C of Actual Peak Temperature (tp)
Ramp-Down Rate
Time 25°C to Peak Temperature
Sn-Pb Solder
3°C/sec max
100°C
150°C
60-120 sec
183°C
60-150 sec
240 +0/-5°C
10-30 sec
6°C/sec max
6 min max.
Pb-Free Solder
3°C /sec max
150°C
200°C
60-180 sec
3°C /sec max
217°C
60-150 sec
260 +0/-5°C
20-40 sec
6°C/sec max
8 min max.
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