MAX8662 데이터 시트보기 (PDF) - Maxim Integrated

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MAX8662

Power-Management ICs for Single-Cell, Li+ Battery-Operated Devices

Maxim Integrated 

Power-Management ICs for

Single-Cell, Li+ Battery-Operated Devices

PIN

MAX8662 MAX8663

40

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41

33

42

34

43

35

44

36

45

37

46

38

47

39

48

40

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Pin Description (continued)

NAME

FUNCTION

PG3

OUT6

IN67

OUT7

VL

SL1

SL2

PSET

POK

EP

Power Ground for Boost Regulator 3. GND, PG1, PG2, and PG3 must be connected

together externally.

Linear Regulator 6 Output. Delivers up to 300mA at an output voltage determined by SL1

and SL2. Connect a 2.2µF ceramic capacitor from OUT6 to GND. Increase the value to

4.7µF if VOUT6 < 1.5V.

Input Supply for Linear Regulators 6 and 7. Connect IN67 to a supply voltage of 1.7V to

VSYS. Connect at least a 1µF ceramic capacitor from IN67 to GND.

Linear Regulator 7 Output. Delivers up to 150mA at an output voltage determined by SL1

and SL2. Connect a 1µF ceramic capacitor from OUT7 to GND. Increase the value to 2.2µF

if VOUT7 < 1.5V.

Input Limiter and Charger Logic Supply. Provides 3.3V when a valid input voltage is

present at DC. Connect a 0.1µF capacitor from VL to GND. VL is capable of providing up to

10mA to an external load when DC is valid.

Output-Voltage Select Inputs 1 and 2 for Linear Regulators. Leave disconnected, or

connect to GND or SYS to set to one of three states. SL1 and SL2 set the output voltage of

OUT4, OUT5, OUT6, and OUT7 to one of nine combinations. See Table 3.

Input Current-Limit Set Input. Connect a resistor (RPSET) from PSET to ground to program

the DC input current limit from 500mA to 2A.

Power-Ok Output. POK is an open-drain nMOS output that pulls low when a valid input is

detected at DC. This output is not affected by the states of PEN1, PEN2, or CEN.

Exposed Paddle. Connect the exposed paddle to ground. Connecting the exposed paddle

to ground does not remove the requirement for proper ground connections to GND, PG1,

PG2, and PG3. The exposed paddle is attached with epoxy to the substrate of the die,

making it an excellent path to remove heat from the IC.

20 ______________________________________________________________________________________

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