4.8 Package Dimensions—196 MAPBGA
The package dimensions for the MCF5208CVM166 device is shown below.
Electrical Characteristics
Top View
Bottom View
Figure 10. MCF5208CVM166 Package Dimensions (196 MAPBGA)
5 Electrical Characteristics
The following electrical specifications are preliminary and are from previous designs or design
simulations. These specifications may not be fully tested or guaranteed at this early stage of the product
life cycle; however, for production silicon, these specifications are met. Finalized specifications will be
published after complete characterization and device qualifications have been completed.
MCF5208 ColdFire® Microprocessor Data Sheet, Rev. 1
Freescale Semiconductor
17