NXP Semiconductors
7. Pinning information
7.1 Smart card contactless module
MF1PLUSx0y1
Mainstream contactless smart card IC
LA
top view
LB
Fig 2. Contact assignments for SOT500-2 (MOA4)
001aaj820
Table 3. Bonding pad assignments to smart card contactless module
Contactless interface module
MF1PLUSx0y1DA4/03 and /13
Antenna contacts Symbol
Description
LA
LA
antenna coil connection LA
LB
LB
antenna coil connection LB
MF1PLUSX0Y1_SDS
Product short data sheet
PUBLIC
All information provided in this document is subject to legal disclaimers.
Rev. 3.2 — 21 February 2011
163532
© NXP B.V. 2011. All rights reserved.
5 of 20