FCM8201 데이터 시트보기 (PDF) - Fairchild Semiconductor
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FCM8201 Datasheet PDF : 21 Pages
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Physical Dimensions
9.0
7.0
D
24
25
A
17
16
B
8.70
0.80
7.0
9.0
32
9
1
PIN #1 IDENT
8
TOP VIEW
1.45
1.35
SEE DETAIL A
0.8
32X
0.20 C A-B D
ALL LEADTIPS
1.80
C SEATING PLANE
0.45
LAND PATTERN
RECOMMENDATION
8.70
NOTES:
0.45
0.30
7.1 32X
6.9
SIDE VIEW
0.20 C A-B D
R0.08 MIN
R0.08-0.20
0.25
A) CONFORMS TO JEDEC MS-026 VARIATION BBA
B) ALL DIMENSIONS IN MILLIMETERS.
C) DIMENSIONING AND TOLERANCING PER ASME
Y14.5M-1994.
E) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD
FLASH, AND TIE BAR PROTRUSIONS.
F) LANDPATTERN STANDARD:
QFP80P900X900X160-32BM.
G) DRAWING FILE NAME: MKT-VBE32AREV2
GAGE PLANE
0.75
0.45
1.0
12° TOP & BOTTOM
1.6 MAX
0.20 MIN
0.15
0.05
DETAIL A
0.10 C
Figure 25. 32-Leadless Quad Flat Pack Package (LQFP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2010 Fairchild Semiconductor Corporation
FCM8201 • Rev. 1.0.0
20
www.fairchildsemi.com
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