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L5956PD 데이터 시트보기 (PDF) - STMicroelectronics

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L5956PD Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
L5956
4
Package information
Package information
In order to meet environmental requirements, ST offers this device in ECOPACK® packages.
These packages have a Lead-free second level interconnect. The category of second level
Interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 10. PowerSO20 (slug-up) mechanical data and package dimensions
mm
inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 3.25
3.5 0.128
0.138
A2
3 3.15 3.3 0.118 0.124 0.130
A4 0.8
1 0.031
0.039
A5 0.15 0.2 0.25 0.006 0.008 0.010
a1 0.030
-0.040 0.0012
-0.0016
b
0.4
0.53 0.016
0.021
c 0.23
0.32 0.009
0.012
D (1) 15.8
16 0.622
0.630
D1 9.4
9.8 0.370
0.385
D2
1
0.039
E 13.9
14.5 0.547
0.570
E1 (1) 10.9
11.1 0.429
0.437
E2
2.9
0.114
E3 5.8
6.2 0.228
0.244
e 1.12 1.27 1.42 0.044 0.050 0.056
e3
11.43
0.450
G
0
0.1
0
0.004
H 15.5
15.9 0.61
0.625
h
1.1
0.043
L
0.8
1.1 0.031
0.043
N
10¡ (max)
R
0.6
0.024
S
0¡ (min.) 8¡ (max.)
V
5¡ (min.) 7¡ (max.)
(1) ÒD and E1Ódo not include mold flash or protusions.
- Mold flash or protusions shall not exceed 0.15mm (0.006Ó)
- Critical dimensions: ÒEÓ,Òa1Ó,ÒeÓand ÒGÓ.
OUTLINE AND
MECHANICAL DATA
PowerSO20 (SLUG UP)
N
N
b
h x 45û
H
A5
A2 A
e
e3
D2 (x2) DETAIL A
M
E3
V
E2
E
R
A4
c
1
10
E2
20
DETAIL A
E1
0.35
Gage Plane
a1
-C-
D1
11
S
L
SEATING PLANE
GC
(COPLANARITY)
PSO20DME
D
0088529 C
13/16

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