TFA9842AJ 데이터 시트보기 (PDF) - NXP Semiconductors.

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TFA9842AJ

7.5 W stereo power amplifier with volume control

NXP Semiconductors. 

Philips Semiconductors

TFA9842AJ

7.5 W stereo power amplifier with volume control

AUDIO POWER CS NIJMEGEN

TVA

100 nF

220

nF

CIV

22

µF

CIV

SGND

IN2+

220

nF

IN1+

1000 µF

+VP

150 µF

MODE

10

kΩ

10 kΩ

SB ON

MUTE

001aaa426

Fig 15. Printed-circuit board layout (single-sided); components view

13.2.2 Power supply decoupling

Proper supply bypassing is critical for low-noise performance and high supply voltage

ripple rejection. The respective capacitor location should be as close as possible to the

device and grounded to the power ground. Proper power supply decoupling also prevents

oscillations.

For suppressing higher frequency transients (spikes) on the supply line a capacitor with

low ESR, typical 100 nF, has to be placed as close as possible to the device. For

suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g.

1000 µF or greater, must be placed close to the device.

The bypass capacitor connected to pin SVR reduces the noise and ripple on the mid rail

voltage. For good THD and noise performance a low ESR capacitor is recommended.

13.3 Thermal behavior and heatsink calculation

The measured maximum thermal resistance of the IC package, Rth(j-mb), is 2.0 K/W.

A calculation for the heatsink can be made, with the following parameters:

Tamb(max) = 60 °C (example)

VCC = 17 V and RL = 4 Ω (SE)

Tj(max) = 150 °C (specification)

Rth(tot) is the total thermal resistance between the junction and the ambient including the

heatsink. This can be calculated using the maximum temperature increase divided by the

power dissipation:

TFA9842AJ_1

Preliminary specification

Rev. 01 — 28 April 2006

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

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