TEA1738LT 데이터 시트보기 (PDF) - NXP Semiconductors.

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TEA1738LT

GreenChip SMPS control IC

NXP Semiconductors. 

NXP Semiconductors

TEA1738T; TEA1738LT

GreenChip SMPS control IC

12. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

y

Z

8

c

5

E

A

X

HE

vM A

pin 1 index

1

e

A2

A1

4

bp

wM

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT max. A1

A2

A3

bp

cD

(1) E(2)

eH

E

LL

p

QZ v

w

y

(1)

θ

mm

1.75

0.25

0.10

1.45

1.25

0.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

1.27

6.2

5.8

1.05

1.0

0.4

0.7

0.6

0.25 0.25

0.1

0.7

0.3

8o

inches

0.069

0.010

0.004

0.057

0.049

0.01

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.05

0.244

0.228

0.041

0.039

0.016

0.028

0.024

0.01

0.01

0.004

0.028

0.012

0o

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

VERSION

SOT96-1

IEC

076E03

REFERENCES

JEDEC

JEITA

MS-012

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-18

Fig 12. Package outline SOT96-1 (SO8)

TEA1738T_TEA1738LT

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 2 — 14 January 2011

© NXP B.V. 2011. All rights reserved.

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