SCIMX538DZK1C 데이터 시트보기 (PDF) - Freescale Semiconductor

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SCIMX538DZK1C

i.MX53xD Applications Processors for Consumer Products

Freescale Semiconductor 

Electrical Characteristics

Table 4. Absolute Maximum Ratings

Parameter Description

Symbol

Min

Max

Unit

Peripheral Core Supply Voltage

VCC

–0.3

1.35

V

ARM Core Supply Voltage

VDDGP

–0.3

1.35

V

Supply Voltage UHVIO

Supplies denoted as I/O Supply –0.5

3.6

V

Supply Voltage for non UHVIO

Supplies denoted as I/O Supply –0.5

3.3

V

USB VBUS

VBUS

—

5.25

V

Input voltage on USB_OTG_DP, USB_OTG_DN,

USB_H1_DP, USB_H1_DN pins

USB_DP/USB_DN

–0.3

3.631

V

Input/Output Voltage Range

Vin/Vout

–0.5

OVDD +0.32

V

ESD Damage Immunity:

• Human Body Model (HBM)

• Charge Device Model (CDM)

Vesd

—

2000

V

—

500

Storage Temperature Range

TSTORAGE

–40

150

oC

1 USB_DN and USB_DP can tolerate 5 V for up to 24 hours.

2 The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in

Table 112 on page 154. The maximum range can be superseded by the DC tables.

4.1.2 Thermal Resistance

4.1.2.1 TEPBGA-2 Package Thermal Resistance

Table 5 provides the TEPBGA-2 package thermal resistance data.

Table 5. TEPBGA-2 Package Thermal Resistance Data

Rating

Board

Symbol

Value

Unit

Junction to Ambient (natural convection)1, 2

Single layer board

(1s)

RθJA

28

°C/W

Junction to Ambient (natural convection)1, 2, 3

Four layer board

(2s2p)

RθJA

16

°C/W

Junction to Ambient (at 200 ft/min)1, 3

Single layer board

RθJMA

21

°C/W

(1s)

Junction to Ambient (at 200 ft/min)1, 3

Four layer board

RθJMA

13

°C/W

(2s2p)

Junction to Board4

—

RθJB

6

°C/W

Junction to Case5

—

RθJC

4

°C/W

Junction to Package Top (natural convection)6

—

ΨJT

4

°C/W

1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

i.MX53xD Applications Processors for Consumer Products, Rev. 2

18

Freescale Semiconductor

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