UPB1509GV 데이터 시트보기 (PDF) - NEC => Renesas Technology
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UPB1509GV Datasheet PDF : 16 Pages
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PPB1509GV
NOTE ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation).
(3) Keep the wiring length of the ground pins as short as possible.
(4) Connect a bypass capacitor (e.g. 1000 pF) to the VCC pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales representatives.
PPB1509GV
Soldering method
Soldering conditions
Recommended
condition symbol
Infrared ray reflow
Package peak temperature: 235qC,
Hour: within 30 s. (more than 210qC),
Time: 3 times, Limited days: no.*
IR35-00-3
VPS
Package peak temperature: 215qC,
Hour: within 40 s. (more than 200qC),
Time: 3 times, Limited days: no.*
VP15-00-3
Wave soldering
Pin part heating
Soldering tub temperature: less than 260qC,
Hour: within 10 s.
Time: 1 time, Limited days: no.
Pin area temparature: less than 300qC,
Hour: within 3 s./pin
Limited days: no.*
WS60-00-1
* It is the storage days after opening a dry pack, the storage conditions are 25qC, less than 65% RH.
Caution The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
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