24C128C(2012) 데이터 시트보기 (PDF) - Atmel Corporation
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24C128C Datasheet PDF : 22 Pages
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13.5 8U2-1 — 8-ball VFBGA
A1 BALL
PAD
CORNER
f 0.10 C
d 0.10 (4X)
D
A
E
d 0.08 C
C
Øb
j n0.15 m C A B
j n0.08 m C
e
A1 BALL PAD CORNER
21
A
B
C
D
(e1)
B
TOP VIEW
A1
A2
A
SIDE VIEW
d
(d1)
BOTTOM VIEW
8 SOLDER BALLS
Notes:
1. This drawing is for general information.
2. Dimension 'b' is measured at the maximum solder ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
MIN NOM MAX
0.81 0.91 1.00
0.15 0.20 0.25
0.40 0.45 0.50
0.25 0.30 0.35
2.35 BSC
3.73 BSC
0.75 BSC
0.74 REF
0.75 BSC
0.80 REF
NOTE
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
8U2-1, 8-ball, 2.35 x 3.73 mm Body, 0.75 mm pitch,
VFBGA Package
3/20/12
GPC DRAWING NO. REV.
GWW
8U2-1
F
Atmel AT24C128C [DATASHEET] 20
8734B–SEEPR–9/2012
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