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ES2A-TP(2013) 데이터 시트보기 (PDF) - Micro Commercial Components

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ES2A-TP
(Rev.:2013)
MCC
Micro Commercial Components MCC
ES2A-TP Datasheet PDF : 4 Pages
1 2 3 4
M C C            
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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Features

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Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Easy Pick And Place
High Temp Soldering: 260°C for 10 Seconds At Terminals
Superfast Recovery Times For High Efficiency
ES2A
THRU
ES2M
2 Amp Ultra Fast
Recovery
Silicon Rectifier
50 to 1000 Volts
Maximum Ratings
Operating Temperature: -50°C to +150°C
Storage Temperature: -50°C to +150°C
Maximum Thermal Resistance; 20°C/W Junction To Lead
MCC
Catalog
Number
ES2A
ES2B
ES2C
ES2D
ES2G
ES2J
ES2K
ES2M
Device
Marking
ES2A
ES2B
ES2C
ES2D
ES2G
ES2J
ES2K
ES2M
Maximum
Recurrent
Peak Reverse
Voltage
50V
100V
150V
200V
400V
600V
800V
1000V
Maximum
RMS
Voltage
35V
70V
105V
140V
280V
420V
560V
700V
Maximum
DC
Blocking
Voltage
50V
100V
150V
200V
400V
600V
800V
1000V
Electrical Characteristics @ 25°C Unless Otherwise Specified
Average Forward
Current
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
ES2A-D
ES2G-J
ES2K-M
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Maximum Reverse
Recovery Time
ES2A-D
ES2G-J
ES2K-M
Typical Junction
Capacitance
IF(AV)
IFSM
VF
IR
Trr
CJ
2.0A
50A
TJ = 75°C
8.3ms, half sine
.975V
1.35V
1.70V
IFM = 2.0A;
TJ = 25°C*
5µA TJ = 25°C
150µA TJ = 100°C
50ns
60ns
100ns
25pF
IF=0.5A, IR=1.0A,
Irr=0.25A
Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 200 µsec, Duty cycle 2%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
DO-214AC
(HSMA) (High Profile)
H
Cathode Band
J
A
C
E
D
F
G
DIMENSIONS
INCHES
DIM
MIN
MAX
A
.078
.116
B
.067
.089
C
.002
.008
D
---
.02
E
.035
.055
F
.065
.096
G
.205
.224
H
.160
.180
J
.100
.112
MM
MIN
1.98
1.70
.05
---
.89
1.65
5.21
4.06
2.57
B
MAX
2.95
2.25
.20
.51
1.40
2.45
5.69
4.57
2.84
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090”
0.085”
0.070”
Revision: C
www.mccsemi.com
1 of 4
2013/01/01

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