AAT3689 데이터 시트보기 (PDF) - Advanced Analogic Technologies
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AAT3689 Datasheet PDF : 20 Pages
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AAT3689
0.5A/1.0A USB Port/Adapter
Lithium-Ion/Polymer Battery Charger
Event Description
Charge Disabled or Low Supply
Charge Enabled Without Battery
Battery Charging
Charge Completed
Fault
STAT1
Off
Flash1
On
Off
On
Table 3: Status LED Display Conditions.
STAT2
Off
Flash1
Off
On
On
Capacitor Selection
Input Capacitor
In general, it is good design practice to place a
decoupling capacitor between the ADP and USB
pins and ground. An input capacitor in the range of
1μF to 22μF is recommended. If the source supply
is unregulated, it may be necessary to increase the
capacitance to keep the input voltage above the
under-voltage lockout threshold during device
enable and when battery charging is initiated.
If the AAT3689 adapter input is to be used in a sys-
tem with an external power supply source, such as
a typical AC-to-DC wall adapter, then a CIN capaci-
tor in the range of 10μF should be used. A larger
input capacitor in this application will minimize
switching or power bounce effects when the power
supply is "hot plugged." Likewise, a 10μF or greater
input capacitor is recommended for the USB input
to help buffer the effects of USB source power
switching, noise, and input cable impedance.
Output Capacitor
The AAT3689 only requires a 1μF ceramic capaci-
tor on the BAT pin to maintain circuit stability. This
value should be increased to 10μF or more if the
battery connection is made any distance from the
charger output. If the AAT3689 is to be used in
applications where the battery can be removed
from the charger, such as in the case of desktop
charging cradles, an output capacitor greater than
10μF may be required to prevent the device from
cycling on and off when no battery is present.
Printed Circuit Board Layout
Considerations
For the best results, it is recommended to physical-
ly place the battery pack as close to the AAT3689
BAT pin as possible. To minimize voltage drops on
the PCB, keep the high current carrying traces ade-
quately wide. For maximum power dissipation of
the AAT3689 TDFN package, the metal substrate
should be solder bonded to the board. It is also rec-
ommended to maximize the substrate contact to the
PCB ground plane layer to further increase local
heat dissipation.
1. Flashing rate depends on output capacitance.
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3689.2006.11.1.0
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