ACPM-7353 데이터 시트보기 (PDF) - Avago Technologies

부품명

상세내역

제조사

ACPM-7353

CDMA Dual Band 4x5 Power Amplifier Module (Cellular/PCS)

Avago Technologies 

Reflow Profile Recommendations

Tp

TL

Ts max

Ts min

ts

Preheat

Ramp-up

tp

tL

Critical Zone

T L to Tp

Ramp-down

25

t 25oC to Peak

Time

Typical SMT Reflow Profile for Maximum Temperature = 260 +0/-5°C

Typical SMT Reflow Profile for Maximum Temperature = 260 +0/ -5°C

Profile Feature

Average ramp-up rate (TL to TP)

Preheat

- Temperature Min (Tsmin)

- Temperature Max (Tsmax)

- Time (min to max) (ts)

Sn-Pb Solder

3°C/sec max

100°C

150°C

60-120 sec

Tsmax to TL

- Ramp-up Rate

Time maintained above:

- Temperature (TL)

- Time (TL)

Peak temperature (Tp)

Time within 5°C of actual Peak Temperature (tp)

Ramp-down Rate

Time 25°C to Peak Temperature

183°C

60-150 sec

240 +0/-5°C

10-30 sec

6°C/sec max

6 min max.

Pb-Free Solder

3°C/sec max

150°C

200°C

60-120 sec

3°C/sec max

217°C

60-150 sec

260 +0/-5°C

20-40 sec

6°C/sec max

8 min max.

14

Share Link: