AD6655 데이터 시트보기 (PDF) - Analog Devices

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AD6655

IF Diversity Receiver

Analog Devices 

AD6655

ABSOLUTE MAXIMUM RATINGS

Table 10.

Parameter

ELECTRICAL

AVDD, DVDD to AGND

DRVDD to DRGND

AGND to DRGND

VIN+A/VIN+B, VIN-A/VIN−B to AGND

CLK+, CLK− to AGND

SYNC to AGND

VREF to AGND

SENSE to AGND

CML to AGND

RBIAS to AGND

CSB to AGND

SCLK/DFS to DRGND

SDIO/DCS to DRGND

SMI SDO/OEB to DRGND

SMI SCLK/PDWN to DRGND

SMI SDFS to DRGND

D0A/D0B through D13A/D13B

to DRGND

FD0A/FD0B through FD3A/FD3B to

DRGND

DCOA/DCOB to DRGND

ENVIRONMENTAL

Operating Temperature Range

(Ambient)

Maximum Junction Temperature

Under Bias

Storage Temperature Range

(Ambient)

Rating

−0.3 V to +2.0 V

−0.3 V to +3.9 V

−0.3 V to +0.3 V

−0.3 V to AVDD + 0.2 V

−0.3 V to +3.9 V

−0.3 V to +3.9 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to +3.9 V

−0.3 V to +3.9 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−40°C to +85°C

150°C

−65°C to +125°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL CHARACTERISTICS

The exposed paddle must be soldered to the ground plane for

the LFCSP package. Soldering the exposed paddle to the

customer board increases the reliability of the solder joints,

maximizing the thermal capability of the package.

Table 11. Thermal Resistance

Package

Type

Airflow

Velocity

(m/s)

θJA1, 2

64-Lead LFCSP 0

18.8

9 mm × 9 mm 1.0

16.5

(CP-64-3)

2.0

15.8

θJC1, 3

0.6

θJB1, 4

6.0

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Unit

°C/W

°C/W

°C/W

Typical θJA is specified for a 4-layer PCB with solid ground

plane. As shown, airflow increases heat dissipation, which

reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

Rev. 0 | Page 18 of 84

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