AD9653-125EBZ 데이터 시트보기 (PDF) - Analog Devices
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AD9653-125EBZ Datasheet PDF : 40 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Electrical
AVDD to AGND
DRVDD to AGND
Digital Outputs
(D0±x, D1±x, DCO+, DCO−, FCO+,
FCO−) to AGND
CLK+, CLK− to AGND
VIN+x, VIN−x to AGND
SCLK/DTP, SDIO/OLM, CSB to AGND
SYNC, PDWN to AGND
RBIAS to AGND
VREF, SENSE to AGND
Environmental
Operating Temperature
Range (Ambient, VREF = 1.0 V)
Operating Temperature
Range (Ambient, VREF = 1.3 V)
Maximum Junction
Temperature
Lead Temperature
(Soldering, 10 sec)
Storage Temperature
Range (Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−40°C to +85°C
0°C to 85°C
150°C
300°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
AD9653
THERMAL RESISTANCE
Table 9. Thermal Resistance
Air Flow
Velocity
Package Type (m/sec)
θJA1
48-Lead LFCSP 0.0
23.7
7 mm × 7 mm 1.0
20.0
(CP-48-13)
2.5
18.7
θJB
θJC Unit
7.8 7.1 °C/W
N/A N/A °C/W
N/A N/A °C/W
1 θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ESD CAUTION
Rev. 0 | Page 11 of 40
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